I will discuss a bit about the path that connects between the IC schematic. So the damage detection easier and shorter.
I started from the bottom:
1. Charging / charging
The voltage of the charger that comes in through the plug in cgarger and processed by TAHVO, etc. to the CPU. Damage no charging or the phone can not charge the battery held by TAHVO.
2. UI Interface
UI Interface For the first held by OMAP (camera, keyboard, LCD, MMC) and all the data held by the NAND Flash. So if there is damage in one component on top of the first component that is checked is the OMAP and NAND Flash. NAND Flash itself has a data storage space of 256Mb 512Mb sampi used for internal storage of data such as photos, ring tones and phone book.
UI Interface are both held by the retu (vibra, mic, IHF, speakers, driver's license, ALS and power on). If there is damage in this section is in retu handling and voltage lines are out of retu. Voltage used during flashing is also supplied by retu.
3. signal
Here are Ritsa RF (+ Vinku Hinku / Ahne / Pihi). Processed by the RF signal which is then processed by the main CPU RAP3G/RAPGSM. Voltage used by the RF comes from retu. If the supply voltage of retu broken or lost then the signal will also be lost. Damage no signals at frequent BB5 karne suplly less voltage. can also occur due to the calibration signal at the PM (Permanent Memory corrupted) situated in the NOR Flash. 64MB NOR Flash your own capacity.
